A MATHEMATICAL MODEL FOR TEMPERATURE DISTRIBUTION IN MULTILAYERED 3D IC’s USING GALERKIN’S FINITE ELEMENT TECHNIQUE
نویسنده
چکیده
A three dimensional realistically shaped mathematical model, to investigate temperature distribution in a 3D IC has been developed taking into account heat carried by thermal vias and heat generation by the heat sources in the various device layers. Keeping in view the various heterogeneous variations of the thermo physical parameters and nature of the various layers, the 3D IC has been divided into seventy five tetrahedral finite elements of various sizes, which are connected to each other by forty eight nodes. We have also suggested various modifications in the 3D IC to obtain a more uniform temperature profile.
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